Testing: In-line, non-destructive techniques are preferred, often using electromagnetic radiation to measure parameters like layer thickness, composition, and conductivity. Key methods include spectral ellipsometry, Raman spectroscopy, reflectometry, and eddy current measurements. Standards development is ongoing to establish testing protocols specific to printed electronics. Effective testing enables process optimization and helps meet application-specific requirements.
Standardization: Flexible printed electronics enable compact, bendable, and portable designs, but they require specialized testing technologies. Standards can help in selecting the test equipment, test parameters, test data, and fixture required to perform electrical and mechanical test(s) on flexible printed electronics. Depending on the end market application of a device, testing standards may exist.
IEC creates standards for electrical, electronic and related technologies with technical committee TC119 focusing on printed electronics. More than 40 International Standards (IS) and Technical Reports (TR) have been published. SEMI has a specific chapter for flexible and printed electronics (FPE) that includes printed electronics and existing SEMI standards can be applied to the broader electronics supply chain. Global Electronics Association, formerly known as IPC, aims to support the development of a world market in printed electronics through the IPC Printed Electronics Initiative.
Implementation example
In-line interferometer solutions
An in-line wavelength selective interferometer for measuring surface topography at the micro- and nanoscales. By capturing pixel by pixel data, sharp changes in height can be measured, such as steps or trenches.
Web guide system
Web guide system with an integrated camera, designed for precise alignment and monitoring in roll-to-roll processing.